PART OF THE NOVA PLATFORM · KAMPALA, UGANDA · MALATYA, TURKEY · GLASGOW, SCOTLAND
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Bergquist

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

Part No. HF650P-0.001-01-00-122
Thickness 0.001in
Thermal Conductivity 1.5W/m·K
Material Hi-Flow 650P
Self-Adhesive Yes
Minimum Operating Temperature -40°C
Maximum Operating Temperature +150°C
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Thickness 0.001in
Thermal Conductivity 1.5W/m·K
Material Hi-Flow 650P
Self-Adhesive Yes
Minimum Operating Temperature -40°C
Maximum Operating Temperature +150°C
Material Trade Name Hi-Flow 650P
Operating Temperature Range -40 → +150 °C

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