PART OF THE NOVA PLATFORM · KAMPALA, UGANDA · MALATYA, TURKEY · GLASGOW, SCOTLAND
Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm
Bergquist

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

Part No. SPK10-0.006-00-104
Dimensions 25.4 x 19.05mm
Thickness 0.152mm
Length 25.4mm
Width 19.05mm
Thermal Conductivity 1.3W/m·K
Material Thin Film Polyimide
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Dimensions 25.4 x 19.05mm
Thickness 0.152mm
Length 25.4mm
Width 19.05mm
Thermal Conductivity 1.3W/m·K
Material Thin Film Polyimide
Minimum Operating Temperature -60°C
Maximum Operating Temperature +180°C
Hardness Shore A 90
Material Trade Name Sil-Pad K10
Operating Temperature Range -60 → +180 °C

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